G will push antenna technology to new limits, demanding intelligent, adaptive, and multi-band systems capable of supporting ...
Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI ...
Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by Assembling Different Silicon Technologies at the Wafer Level, Allowing Dense Co-integration of ...
CEA-Leti and STMicroelectronics have outlined a method that could push RF modules towards full monolithic integration on ...
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