A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

For decades, a four-year college degree was widely seen as the standard path to getting most midlevel jobs in the United ...

Adam Seams has had quite a ride as a student-athlete at WVU Tech. And really, the immediate past has been a microcosm of the last two and a half years. From soccer to basketball. Back to soccer. Back ...

Abstract: Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a ...