A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

A key element of Mitsubishi’s new forged molding compound (FMC) carbon fiber-reinforced SMC is the use of low-flow (but not low-pressure) compression molding, which ...

Compression molding involves forming of complex shaped components by molding of a charge of fiber reinforced prepreg bulk molding compound (BMC) under heat and high pressures. Unidirectional fiber ...

An MCAM customer wanted to replace metal injection molded (MIM) magnesium with a composite on a performance mountain bike’s suspension elements with the goals of reducing mass and avoiding processing ...